发明名称 Method of producing silicon carbide semiconductor substrate, silicon carbide semiconductor substrate obtained thereby and silicon carbide semiconductor using the same
摘要 The present invention provides a method of producing a silicon carbide semiconductor substrate in which a silicon carbide buffer layer doped with germanium and a semiconductor device layer are sequentially laminated on the buffer layer, a silicon carbide semiconductor substrate obtained by the method and a silicon carbide semiconductor in which electrodes are disposed on the silicon carbide semiconductor substrate.
申请公布号 US8338833(B2) 申请公布日期 2012.12.25
申请号 US20060580978 申请日期 2006.10.16
申请人 SEKI AKINORI;TANI YUKARI;SHIBATA NORIYOSHI;TOYOTA JIDOSHA KABUSHIKI KAISHA;JAPAN FINE CERAMICS CENTER 发明人 SEKI AKINORI;TANI YUKARI;SHIBATA NORIYOSHI
分类号 H01L21/331;H01L31/0312;H01L21/04;H01L21/20;H01L21/205;H01L21/338;H01L29/167;H01L29/24;H01L29/737;H01L29/778;H01L29/812 主分类号 H01L21/331
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