发明名称 Leadframe based magnetics package
摘要 A magnetics package comprising: a primary coil configured to conduct a current flow; a secondary coil electrically isolated from the primary coil and configured to conduct a current flow, wherein the secondary coil is embedded in a mold compound; and a magnetic core inductively coupling the primary coil and the secondary coil, wherein a current flow in the primary coil produces a magnetic field in the magnetic core, and the magnetic field in the magnetic core induces a current flow in the secondary coil.
申请公布号 US8339231(B1) 申请公布日期 2012.12.25
申请号 US20100729082 申请日期 2010.03.22
申请人 JOSHI RAJEEV;FLEXTRONICS AP, LLC 发明人 JOSHI RAJEEV
分类号 H01F5/00;H01F27/28;H01F27/29 主分类号 H01F5/00
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