发明名称 |
Backside illuminated image sensor with stressed film |
摘要 |
A backside illuminated (BSI) complementary metal-oxide semiconductor (CMOS) image sensor includes a photosensitive region disposed within a semiconductor layer and a stress adjusting layer. The photosensitive region is sensitive to light incident on a backside of the BSI CMOS image sensor to collect an image charge. The stress adjusting layer is disposed on a backside of the semiconductor layer to establish a stress characteristic that encourages photo-generated charge carriers to migrate towards the photosensitive region. |
申请公布号 |
US8338856(B2) |
申请公布日期 |
2012.12.25 |
申请号 |
US20100853803 |
申请日期 |
2010.08.10 |
申请人 |
TAI HSIN-CHIH;RHODES HOWARD E.;ZHENG WEI;VENEZIA VINCENT;QIAN YIN;MAO DULI;OMNIVISION TECHNOLOGIES, INC. |
发明人 |
TAI HSIN-CHIH;RHODES HOWARD E.;ZHENG WEI;VENEZIA VINCENT;QIAN YIN;MAO DULI |
分类号 |
H01L31/0328 |
主分类号 |
H01L31/0328 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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