发明名称 Backside illuminated image sensor with stressed film
摘要 A backside illuminated (BSI) complementary metal-oxide semiconductor (CMOS) image sensor includes a photosensitive region disposed within a semiconductor layer and a stress adjusting layer. The photosensitive region is sensitive to light incident on a backside of the BSI CMOS image sensor to collect an image charge. The stress adjusting layer is disposed on a backside of the semiconductor layer to establish a stress characteristic that encourages photo-generated charge carriers to migrate towards the photosensitive region.
申请公布号 US8338856(B2) 申请公布日期 2012.12.25
申请号 US20100853803 申请日期 2010.08.10
申请人 TAI HSIN-CHIH;RHODES HOWARD E.;ZHENG WEI;VENEZIA VINCENT;QIAN YIN;MAO DULI;OMNIVISION TECHNOLOGIES, INC. 发明人 TAI HSIN-CHIH;RHODES HOWARD E.;ZHENG WEI;VENEZIA VINCENT;QIAN YIN;MAO DULI
分类号 H01L31/0328 主分类号 H01L31/0328
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