Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereof

摘要

A substrate for integrated circuit package is disclosed. The substrate comprises an electrically conductive leadframe having a first side and an opposing second side. The substrate has a first bonding compound disposed in a first recessed portion of the first side and a second bonding compound disposed in at least a portion of a second recessed portion of the leadframe, selectively exposing a selected area of the leadframe on the second side. In an exemplary embodiment, the second bonding compound is a photolithographic material. A method of manufacturing a substrate for integrated circuit package is also disclosed.