发明名称 |
Adhesive compositions for use in die attach applications |
摘要 |
Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly. |
申请公布号 |
US8338536(B2) |
申请公布日期 |
2012.12.25 |
申请号 |
US20100884300 |
申请日期 |
2010.09.17 |
申请人 |
NGUYEN MY;TAKANO TADASHI;LIU PUWEI;HENKEL CORPORATION |
发明人 |
NGUYEN MY;TAKANO TADASHI;LIU PUWEI |
分类号 |
C08L63/00;B32B27/38;C08L63/02;C08L63/06;C09J163/00;C09J163/02;C09J163/06 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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