发明名称 |
Mechanical tape separation package and method |
摘要 |
A method of fabricating a plurality of electronic component packages includes coupling a tape to a panel. Electronic components are coupled to the tape and encapsulated to form a molded wafer. The molded wafer is mechanically separated from the panel without heating by breaking a mechanical separation adhesive of the tape. By mechanically separating the molded wafer from the panel without heating, warpage of the molded wafer associated with heating is avoided.
|
申请公布号 |
US8337657(B1) |
申请公布日期 |
2012.12.25 |
申请号 |
US20100913325 |
申请日期 |
2010.10.27 |
申请人 |
AMKOR TECHNOLOGY, INC. |
发明人 |
DUNLAP BRETT ARNOLD;DARVEAUX ROBERT FRANCIS |
分类号 |
B29C65/50;B32B37/26;B32B38/10 |
主分类号 |
B29C65/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|