发明名称 |
Power semiconductor device package method |
摘要 |
Preparation methods of forming packaged semiconductor device, specifically for flip-chip vertical power device, are disclosed. In these methods, a vertical semiconductor chip is flip-chip attached to a lead frame and then encapsulated with plastic packing materials. Encapsulated chip is then thinned to a predetermined thickness. Contact terminals connecting the chip with external circuit are formed by etching at least a bottom portion of the lead frame connected.
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申请公布号 |
US8338232(B2) |
申请公布日期 |
2012.12.25 |
申请号 |
US201113045407 |
申请日期 |
2011.03.10 |
申请人 |
SHI LEI;XUE YAN XUN;GONG YUPING;ALPHA & OMEGA SEMICONDUCTOR, INC. |
发明人 |
SHI LEI;XUE YAN XUN;GONG YUPING |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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