| 摘要 |
PURPOSE: A plating method and apparatus for a substrate production line are provided to simply plate substrates with difference hardness in a single plating bath by regulating the flow direction of copper sulfate with a motor for controlling a valve. CONSTITUTION: A plating apparatus for a substrate production line comprises copper sulfate jet nozzles for hard substrate plating(2), copper sulfate jet nozzles for thin substrate plating(3), a motor(5), and a valve(6). The copper sulfate jet nozzles for hard substrate plating are installed at regular intervals in a plating bath. The copper sulfate jet nozzles for thin substrate plating are installed alternately with the copper sulfate jet nozzles for hard substrate plating. The copper sulfate jet nozzles are connected through a single pipe line(4). The valve is installed by the motor between the copper sulfate jet nozzles to selectively control the flow of copper sulfate and spray copper sulfate through a nozzle suitable for a substrate.
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