PACKAGED DEVICE INCLUDING INTERPOSER FOR INCREASED ADHESIVE THICKNESS AND METHOD OF ATTACHING DIE TO SUBSTRATE

摘要

PURPOSE: A packaged apparatus including an interposer for an increased adhesive thickness and a method of attaching a die to a substrate are provided to improve performance of the packaged device by a bonding layer to a package substrate. CONSTITUTION: A non-conductive interposer(30) comprises a first surface and a second surface which are flat and face each other. The first surface and the second surface are formed in parallel. A first bonding layer(32) is formed between a first surface of a package substrate(11) and the first surface of the non-conductive interposer. The non-conductive interposer is attached to the first surface of the package substrate using the first bonding layer. The non-conductive interposer is bonded with the package substrate.