STRUCTURE D'ENCAPSULATION D'UN MICRO-DISPOSITIF COMPORTANT UN MATÉRIAU GETTER

摘要

The structure (100) has a cavity (106) in which a micro-device (104) is provided. The cavity is bounded by substrate (102) and another substrate (108) that is integral with the former substrate through a bonding interface (110) consisting of metal or dielectric material. A main face (112) of the latter substrate facing the former substrate is covered with a getter material layer (114). The interface is provided between the former substrate and the layer. The latter substrate forms a continuous cap. The layer has a thickness between about 100 nanometers and 2 micrometers. An independent claim is also included for a method for producing an encapsulating structure of a micro-device.