发明名称 |
ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD |
摘要 |
It is an object to provide an electronic component mounting apparatus and an electronic component mounting method that make it possible to assure stable pickup operation even when a dimensional error attributable to a difference in production lot exists in electronic components or carrier tapes. During electronic component mounting adopting a tape splicing technique for splicing a carrier tape 15 already loaded on a tape feeder to a newly loaded carrier tape 15A, when an optical sensor 30 has detected a joint J between the already-loaded carrier tape 15 and the newly-loaded carrier tape 15A, a height measurement device 12 performs measurement of a component pickup height targeted for components P housed in the carrier tape 15A in connection with the tape feeder for which the joint J has been detected. Component pickup height data showing a target lowering height to which pickup nozzles 10a are to be lowered are updated on the basis of the measurement result.
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申请公布号 |
US2012317802(A1) |
申请公布日期 |
2012.12.20 |
申请号 |
US201113578055 |
申请日期 |
2011.05.11 |
申请人 |
YAMAMOTO SHINJI;ISHITANI YASUYUKI;PANASONIC CORPORATION |
发明人 |
YAMAMOTO SHINJI;ISHITANI YASUYUKI |
分类号 |
H05K13/04;H05K13/02;H05K13/08 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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