| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermally conductive insulation sheet exhibiting excellent insulation and heat dissipation, and to provide a metal base substrate and a circuit board. <P>SOLUTION: On one or a plurality of longitudinally oriented sheets 4 where hexagonal boron nitrides 2 are oriented in the thickness direction, one or a plurality of laterally oriented sheets 3 where hexagonal boron nitrides 2 are oriented in the width direction or the length direction are laminated to produce a thermally conductive insulation sheet 1. Total thickness of the longitudinally oriented sheets 4 is set thicker than the total thickness of the laterally oriented sheets 3. In addition, the thermally conductive insulation sheet 1 and a conductive layer are laminated, in this order, on a metal base material so that the laterally oriented sheet 3 is disposed on the conductor layer side thus obtaining a metal base substrate. Furthermore, a metal base circuit board is produced by processing the conductor layer of the metal base substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
