PASTING STRUCTURE AND MANUFACTURING METHOD OF THE SAME, AND MANUFACTURING METHOD OF STRUCTURE OF SUBSTRATE TO BE TREATED

摘要

PROBLEM TO BE SOLVED: To enhance machining accuracy, processing efficiency and/or security of processing of a substrate to be treated processed under reduced pressure after temporarily adhering a face having an uneven shape of the substrate to be treated and a surface of a base substrate.

SOLUTION: A manufacturing method of one pasting structure 40 includes: a solution temporary adhesive material supplying step for supplying a solution temporary adhesive material whose viscosity is ≥0.02 Pa s and ≤0.1 Pa s at 25°C on a first surface 42 of a substrate to be treated 41 having the first surface on which a concave 42A and a projection 42B are formed; a temporary adhesive material forming step in which the projection 42B of the first surface 42 is covered with a temporary adhesive material 46B of >10 μm and ≤20 μm thickness by heating the solution temporary adhesive material; and a pasting step for temporarily adhering the first surface 42 and the planer base substrate 48 together through the temporary adhesive material 46B.

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