| 摘要 |
Methods of dicing substrates by both laser scribing and plasma etching. A method includes laser ablating material layers, the ablating leading with a first irradiance and following with a second irradiance, different than the first. An asymmetrically shaped beam having an asymmetrical spatial profile along the direction of travel, multiple passes of a beam adjusted to have different irradiance levels, and multiple laser beams having various irradiance levels may be utilized to ablate at least a mask with the first irradiance and expose the substrate with the second irradiance.
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