发明名称 APPARATUS AND METHOD FOR TREATING SUBSTRATE
摘要 Provided are an apparatus and method for treating a substrate, and more particularly, to a substrate treatment apparatus having a cluster structure and a substrate treatment method using the same. The apparatus for treating the substrate includes a load port on which a container for receiving the substrate is placed, a treatment module for treating the substrate, and a transfer module including a robot for transferring the substrate between the container and the treatment module. The treatment module includes a transfer chamber including a robot for transferring the substrate, a load lock chamber disposed between the transfer chamber and the transfer module, a first treatment chamber disposed spaced from the transfer module around the transfer chamber to perform a first treatment process, and a second treatment chamber disposed around the transfer chamber to perform a second treatment process.
申请公布号 US2012322015(A1) 申请公布日期 2012.12.20
申请号 US201213485300 申请日期 2012.05.31
申请人 KIM HYUNG JOON 发明人 KIM HYUNG JOON
分类号 B25J11/00;B05D1/00;B05D3/02;B32B38/10;C23C16/513;C23F1/00;F27D3/00;H01L21/677 主分类号 B25J11/00
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