| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a copper alloy for an electronic device, which has a low Young's modulus, high proof stress, high conductivity, and excellent bendability and is suitable for electronic and electric parts, such as a terminal, a connector, and a relay; a method for producing the copper alloy for an electronic device; and a copper alloy rolled material for an electronic device. <P>SOLUTION: The copper alloy for an electronic device includes Mg in a range of not less than 3.3 atom% but less than 6.9 atom%, and at least one of Cr and Zr, each in a range of 0.001-0.15 atom% with the balance of Cu and unavoidable impurities. When defining the concentration of Mg as A atom%, the electrical conductivity σ (%IACS) is within the following range: σ≤1.7241/(-0.0347×A<SP POS="POST">2</SP>+0.6569×A+1.7)×100. <P>COPYRIGHT: (C)2013,JPO&INPIT |
