| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that allows achieving high reliability and to provide a wiring board on which a semiconductor element is mounted. <P>SOLUTION: A semiconductor device 10 comprises: an insulating substrate 121; a wiring layer 122 formed on a first primary surface 121a of the insulating substrate 121; and a semiconductor element 14 mounted on the wiring layer 122. In the semiconductor device 10, the wiring layer 122 is composed of a first copper-containing material containing copper and a metal having a smaller thermal expansion coefficient than copper, and the thermal expansion coefficient of the first copper-containing material is smaller than that of copper. In addition, the semiconductor device comprises a heat radiation layer 123 formed on a second primary surface 121b on the opposite side of the first primary surface 121a of the insulating substrate 121, and a heat sink 16 bonded to the insulating substrate 121 via the heat radiation layer 123. The heat radiation layer 123 is composed of a second copper-containing material containing copper. <P>COPYRIGHT: (C)2013,JPO&INPIT |
