发明名称 |
METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR CRYSTAL LAYER AND NITRIDE SEMICONDUCTOR CRYSTAL LAYER |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a nitride semiconductor crystal layer with further high quality and to provide the nitride semiconductor crystal layer. <P>SOLUTION: A nitride semiconductor crystal layer having a thickness of 1 μm or more is formed on a silicon crystal layer having a thickness of 20 μm or less provided on a substrate of which a silicon oxide film is formed on the surface. After a first portion of the nitride semiconductor crystal layer is formed on the silicon crystal layer, a second portion is formed at a higher temperature than the first portion. The silicon crystal layer is divided into island-shaped layers having a characteristic length of 0.5 mm or more to 10 mm or less in a surface parallel to the layer surface of the silicon crystal layer. A plurality of nitride semiconductor crystal layers separated from each other are selectively formed on each of the divided silicon crystal layers. The thickness of the silicon crystal layer is reduced by making at least a portion of the silicon crystal layer incorporated into the nitride semiconductor crystal layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012253364(A) |
申请公布日期 |
2012.12.20 |
申请号 |
JP20120157673 |
申请日期 |
2012.07.13 |
申请人 |
TOSHIBA CORP |
发明人 |
SUGIYAMA NAOJI;SHIODA MICHIYA;NUNOUE SHINYA |
分类号 |
H01L21/205;C23C16/34;C30B25/18;C30B29/38;H01L21/20;H01L31/10;H01L33/32 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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