发明名称 METHOD AND APPARATUS FOR MOUNTING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To prevent each electronic component mounting apparatus from bottlenecking production efficiency balance of electronic component mounting apparatuses on a mounting line even if there is a significant difference in electronic component mounting time between mounting heads provided on two beams. <P>SOLUTION: When there is a substrate that has been mounted in an electronic component mounting apparatus 1, if there is a substrate on an opposite conveyance device 2A or 2B, a CPU 15 identifies an electronic component mounting state of the substrate in the opposite lane, extracts unexecuted mounting step numbers for an assist to be performed in one cycle of reciprocation between an opposite component supply device 3A or 3B and the substrate, and writes "1" to status information and a number of an assisting mounting head 6A or 6B under assist data A for the extracted mounting step numbers. The mounting head 6A or 6B of the number thus written is used to pick up electronic components from component supply units 8 on an opposite cart 7B or 7A and mount them on a substrate P in the opposite lane. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012253084(A) 申请公布日期 2012.12.20
申请号 JP20110122608 申请日期 2011.05.31
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 OYAMA KAZUYOSHI;IZUMIHARA KOICHI;KAMEDA MAKIO;ONISHI SEIJI;MIWA TAKESHI
分类号 H05K13/04;H05K13/02 主分类号 H05K13/04
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