| 摘要 |
Provided are a semiconductor unit wherein uniform parallel operations are performed by chips, and a low-cost and highly reliable semiconductor device, which is manufactured using the semiconductor unit, and has small thermal resistance. A plurality of small identical semiconductor chips (SiC-Di chips (2)), each of which is formed of a SiC substrate, i.e., wide gap substrate, are sandwiched between two conducting plates (common copper plates (1, 8)), and are connected in parallel, and a semiconductor unit (100) is formed. Consequently, parallel operations of the semiconductor chips (SiC-Di chips (2)) are made uniform, and the highly reliable semiconductor unit (100) that can eliminate breakage due to current concentration is provided. |
