| 摘要 |
<p>An objective of the present invention is to allow projecting a visible light laser beam and a near-infrared laser beam on a body to be processed such as a wafer with an inexpensive device configuration with a high degree of controllability, and to allow laser processing the body to be processed with a high degree of productivity. A laser beam processing device comprises: a visible light laser light source (G1) which outputs a visible light laser beam; a visible light optical assembly (GS (an optical fiber (G2) and a collimator lens (G3)) which wave guides the visible light laser beam; a near-infrared laser light source (R1) which outputs a near-infrared laser beam; a near-infrared optical assembly (RS (an optical fiber (R2), a light collection lens (R3), an optical fiber (R4), and a collimator lens (R5)) which wave guides the near-infrared laser beam; and a multiplexing optical assembly (MS (a dichroic mirror (M1), a galvano mirror (M2), and an f? lens (M3)), which multiplexes the visible light laser beam which is wave guided by the visible light optical assembly (GS) and the near-infrared laser beam which is wave guided by the near-infrared optical assembly (RS) and wave guides same to a body to be processed (1).</p> |
