THREE-DIMENSIONAL STRUCTURE AND SENSOR

摘要

PROBLEM TO BE SOLVED: To provide a three-dimensional structure capable of suppressing parasitic capacitance generated between a sensor device and a substrate, and improving electric insulation between the sensor device and the substrate by breaking electric coupling between the sensor device and the substrate, as compared with a conventional one.

SOLUTION: A three-dimensional structure 100 includes a first substrate 1; a porous layer 2 made from an insulator formed on one surface of the first substrate 1; and a second substrate 3 formed on the opposite surface to the surface on which the first substrate 1 is formed on the porous layer 2. A cross-sectional shape in a laminating direction of holes 2a on the porous layer 2 is a honeycomb shape in which the plurality of the regular hexagonal holes 2a is arranged, and the thickness of the porous layer 2 becomes larger than 1 μm.

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