| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package having more excellent side surface electromagnetic shield effect, and to provide an assembling method of the same. <P>SOLUTION: In a semiconductor assembling method, a mother board having a board unit 213 is provided, and an alignment mark 215 for coupling to the ground is disposed at a corner of the board unit 213. A chip 220 is placed on the board unit 213. A seal 230 is formed on an upper surface 211 of the mother board to continuously cover the board unit 213 and a division line. A plurality of half-cut grooves 240 are formed along the division lines on a lower surface 212 of the mother board to pass through at least the mother board. A first electromagnetic shield layer 251 is formed and patterned on the lower surface 212 of the mother board and on a group of the half-cut grooves 240 to cover and couple with the alignment mark 215. After the seal 230 is diced individually, a second electromagnetic shield layer 252 coupled with the first electromagnetic shield layer 251 is formed on a top surface 231 and divided side surfaces 232 of the seal 230. <P>COPYRIGHT: (C)2013,JPO&INPIT |
