发明名称 CONNECTION STRUCTURE OF WIRING BODIES, WIRING BODY, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD OF ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a connection structure of wiring bodies which achieves high heat radiation performance, enables easy assembly of each wiring body, and also enables defects to be easily replaced in an electronic apparatus formed by combining the multiple wiring bodies formed with electronic components mounted thereon. <P>SOLUTION: A connection structure of wiring bodies 100 connects multiple wiring bodies 1. The wiring body includes: a metal plate 2 having heat conductivity; a flexible printed wiring board 3 laminated on the metal plate via an adhesive material; and electronic components 9 mounted on the flexible printed wiring board. While a first connection part 10, formed by extending a part of the flexible printed wiring board from at least one side edge part of the metal plate, is provided, a second connection part 13, connecting with the first connection part of a wiring body adjacently located, is provided in at least the other side edge part of the metal plate. Further, the wiring body includes metal plate coupling means 5, 6, 14 connecting the metal plates with each other. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012253213(A) 申请公布日期 2012.12.20
申请号 JP20110125056 申请日期 2011.06.03
申请人 SUMITOMO ELECTRIC IND LTD 发明人 AKAHA YOSHIHIRO;SAITO HIROHISA;UENISHI NAOTA
分类号 H05K1/14;G02F1/13357;H01R12/78;H05K1/02;H05K7/20 主分类号 H05K1/14
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