| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition containing a phenolic resin, which can function as an alternative material for a polyimide resin and a polybenzoxazole resin, and to provide a method for producing a cured relief pattern using the photosensitive resin composition, a semiconductor device comprising the cured relief pattern, and a novel phenolic resin. <P>SOLUTION: The photosensitive resin composition is used to form a surface protective film or an inter layer insulating film of a semiconductor element, and the composition contains: a phenolic resin (A) by 100 parts by mass, which is a polymerization reaction product of a polymerization component including two or more kinds of phenolic compounds having different numbers of phenolic hydroxyl groups; and a photoacid generator (B) by 0.1 to 50 parts by mass. <P>COPYRIGHT: (C)2013,JPO&INPIT |
