| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can keep airtightness of a hollow part at an atmospheric temperature to prevent entry of a foreign substance and can release a vapor pressure in the hollow part at the time of heating. <P>SOLUTION: A semiconductor device comprises: a semiconductor element 3 mounted on a wiring board 1; a protection member 4 arranged at a distance from the wiring board 1; a first wall member 5 provided between the wiring board 1 and the protection member 4 so as to surround the semiconductor element 3; and a second wall member 6 provided outside the first wall member 5. One end 5a of the first wall member 5 in a height direction is fixed to the protection member 4 and the other end 5b is fixed to the wiring board 1. One end 6b of the second wall member 6 in a height direction is fixed to the wiring board 1 such that the other end 6a of the second wall member 6 in the height direction contacts the protection member 4 at an atmospheric temperature. The first wall member 5 includes a porous layer 5c having air permeability. The second wall member 6 is composed of a material having a linear expansion coefficient smaller than that of the first wall member 5. <P>COPYRIGHT: (C)2013,JPO&INPIT |
