| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesion assisting agent fitted metal foil allowing electroless plating, a printed wiring board advantageous in the formation of fine wiring, electric properties and production costs, high in reliability and excellent in moisture absorbing and heat resisting property, and a process for producing the same. <P>SOLUTION: The adhesion assisting agent fitted metal foil has an adhesion assisting agent layer having a thickness of 0.1-10 μm on metal whose surface has a ten-point average roughness Rz=2.0 μm or less and allows electroless plating by chemically roughening an adhesion assisting agent surface with the metal chemically removed. The metal foil is a copper foil subjected to rustproofing by at least one kind selected from nickel, tin, zinc, chromium, molybdenum, cobalt and oxides thereof. The adhesion assisting agent contains (A) an epoxy resin, (B) a polymer component which is able to be chemically roughed, (C) an epoxy resin curing agent, and (D) a curing accelerator. Furtheremore, 10-80 wt.% of (A) the epoxy resin is a rubber-modified epoxy resin. The component (B) is at least one kind selected from acrylonitrile butadiene rubber, carboxylic acid modified acrylonitrile butadiene rubber, carboxylic acid modified acrylonitrile butadiene rubber particles, core-shell particles of butadiene rubber-acrylic resin, polyvinyl acetal resin and carboxylic acid modified polyvinyl acetal resin. Furthermore, the printed wiring board produced by a usual method using the foil and the process for producing the same are provided. <P>COPYRIGHT: (C)2013,JPO&INPIT |
