MOLDING METHOD, MOLDED PRODUCT, AND DIE

摘要

PROBLEM TO BE SOLVED: To provide a molding method that suppresses the generation of voids in the vicinity of a substrate while securing the alignment accuracy of a substrate when the substrate is integrally formed of hot-melt resin, and manufactures a molded product with superior appearance.

SOLUTION: In the molding method, a wiring substrate 1 is fixed to a lower die 3 with pins 4 for positioning the substrate which advances into a cavity and the hot-melt resin 6 is filled in the cavity. Furthermore, the hot-melt resin 6 is filled in a reserved space 13 between a cavity surface 14 and void-suppressing pins 7 which move to the outside of the cavity. The pins 7 for suppressing voids to advance toward the cavity surface 14 while the pins 4 for positioning the substrate recede toward the cavity surface 11 and thereby the hot-melt resin 6 in the reserved space 13 is extruded into the cavity by the void-suppressing pins 7.

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