| 摘要 |
A thin film deposition apparatus including a vacuum chamber; a substrate arranged inside the vacuum chamber; a container unit containing a deposition material and including a discharge opening to discharge the deposition material in a vaporized state; a first heating unit configured to heat at least a portion of the container unit; and a vapor discharge tube including a first opening connected to the discharge opening, and a second opening to discharge the vaporized deposition material to an outside of the vapor discharge tube, a length of a path connecting a center of the first opening to a center of the second opening along a centerline of the vapor discharge tube being greater than a length of a straight line interconnecting the centers of the first and second openings, the thin film deposition apparatus being configured to apply an electric field to the vapor discharge tube.
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