ELECTRONIC COMPONENT BONDING MATERIAL, COMPOSITION FOR BONDING, BONDING METHOD, AND ELECTRONIC COMPONENT

摘要

An electronic component bonding material includes Ni nanoparticles (1). The Ni nanoparticles (1) have an average particle diameter no greater than 100 nm, and have an oxygen-containing coating (5) provided on the surface of metal particles (3), which are microparticles of Ni or an Ni alloy. The oxygen-containing coating (5) is, e.g., a film of nickel oxide (NiO) or another oxide, or a film of nickel hydroxide (Ni(OH)2) or another hydroxide. The thickness of the oxygen-containing coating (5) is preferably within a range of 1 to 8 nm. The coefficient of variation (CV) of the particle diameter of the metal particles (3) is preferably no greater than 0.2.