SCRUBBING DEVICE FOR WAFER

摘要

A scrubbing device for wafer, comprising: a frame; a supporting member, which is located on the frame for rotatably supporting the wafer(40) on the supporting member; and first and second brush components(20?30), which are oppositely and separately mounted on the frame for scrubbing the two sides of the wafer(40) respectively, wherein the first brush component(20) and the second brush component(30) each includes: an active rotary disk(100), which is rotatably mounted on the frame; a brush(200), which is rotatably mounted on the active rotary disk(100) and rotation axis of the active rotary disk(100) is parallel to rotation axis of the brush(200); and a drive component, which is connected to the active rotary disk(100) and the brush(200) respectively to drive the active rotary disk(100) and the brush(200) to rotate about each rotation axis.