| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method which shorten the processing time. <P>SOLUTION: A substrate processing apparatus includes: a first chamber having a coating part forming a coating film of a liquid body containing oxidizable metals and a solvent on a substrate; a second chamber having a first heating part heating the coating film; and a connection part connecting the first chamber with the second chamber. A third chamber, which has a second heating part heating the coating film applied to the substrate and a pressure adjustment part adjusting a pressure around the coating film and vaporizes at least a part of the solvent contained in the coating film, is used as the connection part. <P>COPYRIGHT: (C)2013,JPO&INPIT |
