| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform stable polishing by reducing the generation of a scratch caused by the polishing. <P>SOLUTION: In this method for polishing a crystal wafer used for polishing the crystal wafer by using a polishing device including a center gear, an upper surface plate using the center gear as a rotary axis, a lower surface plate arranged to face the upper surface plate while using the center gear as a rotary axis, and an internal gear arranged at an edge side of the lower surface plate, and arranging the crystal wafer between the lower surface plate and the upper surface plate, the crystal wafer is polished by interposing one of a potassium fluoride aqueous solution containing nano-bubbles obtained by foaming a predetermined gas, a mixture solution of sodium hydroxide and sodium carbonate, and a potassium hydroxide solution between the crystal wafer and the upper surface plate and between the crystal wafer and the lower surface plate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
