| 摘要 |
A module includes a circuit board, a first and a second circuit block mounted on the top surface of the circuit board, and a first boundary formed between these circuit blocks. The module further includes a first metal piece and a resin part. The first metal piece is mounted on the first boundary. The resin part is provided, on its upper surface, with a first groove in a position corresponding to the first metal piece. The first groove includes a first exposed portion in which the first metal piece is partially exposed from the resin part and is connected to a shielded conductor.
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