| 摘要 |
An endoscope device includes: a circuit board including a mounting surface; an electronic component including a bottom surface facing the mounting surface and a lateral portion; a first electrode mounted across a corner portion of the bottom surface and the lateral portion; a second electrode adjacent to the first electrode and mounted across the bottom surface and the lateral portion; a third electrode mounted on the mounting surface to face the first electrode, including an edge portion following the lateral portion and located outside of a first area of the mounting surface covered by the electronic component, and having a wider area than that of the first electrode and soldered to the first electrode; and a fourth electrode mounted on the mounting surface to face the second electrode, including an edge portion following the lateral portion and located outside of the first area, and soldered to the second electrode.
|
