| 摘要 |
A method of preventing oxidation of multilayer wirings in ultra large scale integrated circuits after alkaline polishing, the method including: a) mixing between 0.5 and 1 wt. % of a surfactant, between 0.05 and 0.5 wt. % of a chelating agent, between 1 and 10 wt. % of a corrosion inhibitor, and deionized water, and stirring to yield a water soluble antioxidant solution with pH value of between 6.8 and 7.5; and b) washing the multilayer wirings in the ultra large scale integrated circuits using the antioxidant solution after alkaline CMP under following conditions: between 1000 and 2000 Pa pressure; between 2000 and 5000 mL/min flow rate; and at least between 0.5 and 1 min washing time. |
