ADHESIVE SHEET, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

摘要

Provided is an adhesive sheet in which cracks do not occur in the adhesive layer during pickup in a range that is advantageous for adhesive strength before and after a UV-curable adhesive layer is cured. The present invention provides an adhesive sheet comprising a substrate and a photocurable adhesive layer formed on one side of the substrate, wherein the storage elastic modulus of the photocured adhesive layer as measured under the conditions noted below is 0.5-2.0 (x 108 Pa), and the value obtained by dividing the storage elastic modulus of the photocured adhesive layer by the storage elastic modulus of the substrate is 1-3. Frequency: 1 Hz, strain: 0.1%, temperature: 30°C.