| 发明名称 |
THERMALLY CURABLE SILICONE RESIN COMPOSITION |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermally curable silicone resin composition having superior sulfur resistance. <P>SOLUTION: The thermally curable silicone resin composition comprises: (A) organopolysiloxane having a silanol group; (B) organopolysiloxane having an alkoxysilyl group; (C) a condensation catalyst; and (D) a thiazole compound and/or a triazine compound. An optical semiconductor-sealing body configured such that the thermally curable silicone resin composition seals an optical semiconductor is also provided. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2012251058(A) |
申请公布日期 |
2012.12.20 |
| 申请号 |
JP20110123826 |
申请日期 |
2011.06.01 |
| 申请人 |
YOKOHAMA RUBBER CO LTD:THE |
发明人 |
TAKEI YOSHIHITO;SAIKI TAKEAKI;ISHIKAWA KAZUNORI;TATEWAKI TAKANOBU |
| 分类号 |
C08L83/04;C08K3/24;C08K5/3492;C08K5/47;C08K5/5419;C08K5/544;H01L23/29;H01L23/31 |
主分类号 |
C08L83/04 |
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