发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 The present invention describes LED packages in the form of a button (100, 100a, 100b, 100c, 100d, 100e), ring (200, 200a, 200b, 200c, 200d), quad-wing (300) or surface mount (400) configurations. These LED packages (100, 200, 300, 400, etc) have contact elements (121, 125, 221, 225, etc) that define two substantially parallel spaced apart planes. In use, these LED packages (100, 200, etc) are disposed between two spaced apart panels (510, 510a, etc). Each inside surface of the panels assembly has a conductive layer (520), each being in electrical contact with an associated contact element (121,125, 221, 225, etc) of each LED package (100, 200, etc). A DC power supply is operable to deliver power to the LED package (100, 200, etc) through the conductive layers (520).
申请公布号 WO2012144958(A3) 申请公布日期 2012.12.20
申请号 WO2012SG00213 申请日期 2012.06.14
申请人 SEOW, THIAM HIN KENNIE 发明人 SEOW, THIAM HIN KENNIE
分类号 F21V21/35;G09F9/33 主分类号 F21V21/35
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