| 摘要 |
<p>Pressure stamp mold comprises at least one stamp (1) formed by a powdered material that is introducible into a cavity of a matrix for compacting and sintering, and an electrically conductive material, where the pressure stamp mold is connectable to an electrical voltage source, and includes a region having different electrical conductivity. The stamp is formed with at least one region having different electrical conductivity with multiple cavities (1.2) and/or regions having at least two parts (1.4, 1.5) of the stamp containing different materials. Pressure stamp mold for spark discharge sintering or field-activated sintering, comprises at least one stamp (1) formed by a powdered material that is introducible into a cavity of a matrix for compacting and sintering, and an electrically conductive material, where the pressure stamp mold is connectable to an electrical voltage source, and includes a region having different electrical conductivity. The stamp is formed with at least one region having different electrical conductivity with multiple cavities (1.2) and/or regions having at least two parts (1.4, 1.5) of the stamp consisting different materials, and/or the region is formed with a pressure plate (2), which is introducible in the matrix between the stamp and the materials to be sintered, where the regions are arranged and/or dimensioned depending on the respective material to be sintered and/or the dimensioning of the workpiece to be sintered.</p> |
