发明名称 SLURRY CIRCULATION APPARATUS, AND METHOD FOR FLUSHING SLURRY CIRCULATION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a slurry circulation apparatus that can reliably remove a slurry residue remaining in the piping, a polishing device and the like to which the slurry is supplied, and can shorten the time required for flushing. <P>SOLUTION: The slurry circulation apparatus 3 includes: first and second supply tanks 41, 42; a supply line 43 for supplying the liquid stored in the first and second supply tanks 41, 42 to first and second CMP devices 21, 22; first and second circulation valves 436, 437 for switching supply sources of the liquid to be supplied to the first and second CMP devices 21, 22; a collecting line 63 for collecting the liquid discharged from the first and second CMP devices 21, 22 in the first and second supply tanks 41, 42; a separator 64 for switching destinations in which the liquid is collected; first and second DIW (de-ionized water) replenishing units 53, 54 for replenishing pure water to the first and second supply tanks 41, 42; and an alkaline solution replenishing unit 55 for replenishing an alkaline solution to the first and second supply tanks 41, 42. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012250324(A) 申请公布日期 2012.12.20
申请号 JP20110125217 申请日期 2011.06.03
申请人 SUMCO CORP 发明人 DAISHO OSAMU
分类号 B24B37/34;B24B37/00;B24B57/00 主分类号 B24B37/34
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