LAMINATED MODULE AND INTERPOSER USED FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a laminated module that can suppress temperature rises accompanying heat generation of semiconductor devices and can cause the semiconductor devices to stably operate even when the laminated module has a structure formed by laminating the semiconductor devices with large power consumption.

SOLUTION: A laminated module comprises: an interposer 70 that has a channel 71 through which a fluid flows; one or more first semiconductor devices disposed on one side of the interposer 70; and one or more second semiconductor devices disposed on a side of the interposer 70 opposite to the one or more first semiconductor devices. The channel 71 of the interposer 70 is configured such that the fluid is adiabatically expanded during moving from a first region to a second region while having the first region with a relatively large cross-sectional area and the second region with a relatively small cross-sectional area.

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