| 发明名称 |
CONNECTION METHOD, CONNECTED-BODY PRODUCTION METHOD AND CONNECTED BODY |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To decrease mounting temperature and ensure connection reliability. <P>SOLUTION: A connected-body production method includes steps of bonding a connecting body and a body to be connected to one another using a photo-curable adhesive, hardening the adhesive by irradiating the adhesive with light, and connecting the connecting body and the body to be connected. The level of illumination by light is increased continuously or stepwise. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2012253282(A) |
申请公布日期 |
2012.12.20 |
| 申请号 |
JP20110126642 |
申请日期 |
2011.06.06 |
| 申请人 |
SONY CHEMICAL & INFORMATION DEVICE CORP |
发明人 |
HAYASHI SHINICHI;TANAKA YUJI |
| 分类号 |
H05K3/32 |
主分类号 |
H05K3/32 |
| 代理机构 |
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