发明名称 ADHESIVE FOR BONDING POLYIMIDE RESINS
摘要 One embodiment relates to an, article and a method for producing an article including a plurality of substrates, and an adhesive bonded between at least two of the plurality of substrates. The adhesive can include a polycarbonate copolymer that includes reacted resorcinol, siloxane, and bisphenol-A. Another embodiment relates to an article having a first polyimide substrate, a second polyimide substrate, and an adhesive bonded between the first substrate and the second substrate. The article can have a 2 minute integrated heat release rate of less than or equal to 65 kilowatt−minutes per square meter (kW−min/m2) and a peak heat release rate of less than 65 kilowatts per square meter (kW/m2) as measured using the method of FAR F25.4, in accordance with Federal Aviation Regulation FAR 25.853(d).
申请公布号 US2012321879(A1) 申请公布日期 2012.12.20
申请号 US201213467751 申请日期 2012.05.09
申请人 TEUTSCH ERICH OTTO;MILNE CRAIG 发明人 TEUTSCH ERICH OTTO;MILNE CRAIG
分类号 B32B37/12;B32B5/18;B32B7/12;B32B27/08;B32B27/28 主分类号 B32B37/12
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