| 摘要 |
<p>A heat sink (1) including a mounting structure, such as a mounting base, and adapted for being mounted in thermal contact with electronics equipment, said heat sink having a first end (A) and a second end (B) opposite said first end (A) and comprising: - a first heat transfer structure (30) comprising spaced apart first walls (35) mounted in thermal contact with said mounting structure, - said first walls (35) defining a plurality of major air flow passages (10) of said heat sink, said major air flow passages (10) extending between said first end (A) and said second end (B) and opening at said first end (A) and said second end (B), and - a plurality of second heat transfer structures (40) mounted in thermal contact with said first walls (35) and including spaced apart second walls (45) defining a plurality of minor flow passages (42) extending between said first end (A) and said second end (B), wherein at least some of said major air flow passages (10, 20) each including two or more of said second heat transfer structures (40) arranged in a spaced apart relationship, a plenum (4) between two adjacent second heat transfer structures (40) in a major air flow passage being defined in part by two opposite first walls (35) of said first heat transfer structure (30).</p> |
