POLYAMIC ACID, POLYIMIDE, POLYAMIC ACID SOLUTION, POLYIMIDE SOLUTION, POLYIMIDE FILMS OBTAINED FROM THESE SOLUTIONS, AND USE OF POLYIMIDE FILMS

摘要

The purposes of the present invention are: to obtain a polyimide which exhibits excellent heat resistance, transparency and optical isotropy and is soluble in an organic solvent; and to provide, using either a polyamic acid which is a precursor of the polyimide or the polyimide, articles or members which are highly required to have excellent heat resistance and transparency, particularly, articles or members wherein this polyamic acid or polyimide solution is applied to the surface of an inorganic substance such as glass, metal, metal oxide, or single-crystal silicon. The purposes can be achieved by a polyamic acid and a polyimide which are each prepared from an alicyclic tetracarboxylic dianhydride and a monomer containing a fluorene structure.