SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

This semiconductor device or the like is provided with a semiconductor module (2), a cooler (3), and a resin mold layer (4) that covers the outer edges of said semiconductor module (2) and cooler (3). The semiconductor module (2) is joined to the top surface of the cooler, and refrigerant-circulation pipes (14, 15) are affixed to side surfaces (20, 22) of the cooler. Protrusions (25, 26) that protrude from the side surfaces (20, 22) of the cooler (3) and enclose the aforementioned pipes (14, 15) are provided on said side surfaces (20, 22).