ADHESIVE FILM FOR A SEMICONDUCTOR PACKAGE

摘要

The present invention relates to an adhesive film for a semiconductor package. In the adhesive film, an adhesive layer (2) for dicing a wafer and an adhesive layer (3) for die bonding are successively stacked on a base film (1). The adhesive layer for dicing consists of an ultraviolet curing-type resin composition. The adhesive layer for die bonding consists of a mixture of a thermosetting resin and a thermoplastic resin, each of which does not contain inorganic particles. When a plurality of semiconductor chips are vertically mounted on a circuit board using the adhesive film which does not contain inorganic particles, pattern damage and chip cracking caused by large-scale particles between the vertical semiconductor chips may be prevented from occurring.