| 摘要 |
A system and apparatus for a flexible package are provided. The flexible package includes a first sealing layer, a first outer layer, and a first grid layer. The first grid layer includes a plurality of intersecting grid members formed of an electroconductive material surrounding a plurality of spaced apertures. The flexible package also includes a second sealing layer, a second outer layer, and a second grid layer. The second grid layer includes a plurality of intersecting grid members formed of an electroconductive material surrounding a plurality of spaced apertures. The grid members of the first grid layer are spaced apart from the grid members of the second grid layer such that electrical discharge between the first grid layer and the second grid layer is prevented when the flexible package is exposed to electromagnetic radiation in a microwave range.
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