发明名称 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN-CURED FILM USING PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT
摘要 A photosensitive resin composition which contains (a) a polybenzoxazole precursor, (b) a sensitizing agent, (c) a solvent, (d) a crosslinking agent, and (e) a heterocyclic compound that has a hydroxyl group, an alkoxy group or a carboxyl group in each molecule.
申请公布号 WO2012172793(A1) 申请公布日期 2012.12.20
申请号 WO2012JP03846 申请日期 2012.06.13
申请人 HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.;MINEGISHI, TOMONORI;KATOGI, SHIGEKI 发明人 MINEGISHI, TOMONORI;KATOGI, SHIGEKI
分类号 G03F7/085;C08G73/22;G03F7/004;G03F7/023;G03F7/40 主分类号 G03F7/085
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